金刚石金属基复合材料关键参数--国外著名厂家与江苏晶锟科技对比
Key Parameters of Diamond MMCs — Comparison: Leading Overseas Suppliers vs. Jiangsu Jingkun Technology
摘要：金刚石金属基复合材料将金刚石的高导热与金属基体的可加工性相结合，是应对高功率密度芯片散热瓶颈的关键材料。其一，热导率：金刚石单晶导热率达 2000 W/(m・K) 量级，复合体可达 400～900 W/(m・K)，远超铜（约 400）与铝（约 230），可显著降低热点温度与热阻。其二，热膨胀系数：通过调节金刚石体积分数，可使其与硅、碳化硅、氮化镓及陶瓷基板精准匹配，抑制热应力与翘曲，延长焊点寿命。其三，密度：金刚石约 3.5 g/cm³，远低于铜（8.9 g/cm³），利于航天、相控阵雷达等轻量化应用。其四，气密性：致密复合材料漏率可低于10⁻⁸ Pa・m³/s，满足气密封装要求，隔绝水汽与污染。其五，比热容：较高热容可缓冲脉冲功率冲击，抑制瞬态结温尖峰。五者协同，使金刚石复合材料成为 IGBT、激光器、射频模块等高功率器件散热与可靠性设计的优选方案。
Abstract：Diamond metal-matrix composites combine the ultra-high thermal conductivity of diamond with the machinability of a metallic matrix, making them a key material for solving the thermal bottleneck of high-power-density chips. First, thermal conductivity: single-crystal diamond reaches ~2000 W/(m·K), and the composite achieves 400–900 W/(m·K), far exceeding copper (~400) and aluminum (~230), effectively reducing hot-spot temperature and thermal resistance. Second, coefficient of thermal expansion (CTE): by tailoring the diamond volume fraction, the CTE can be closely matched to silicon, silicon carbide, gallium nitride, and ceramic substrates, suppressing thermal stress and warpage while extending solder-joint life. Third, density: at ~3.5 g/cm³, the composite is far lighter than copper (8.9 g/cm³), favoring lightweight applications such as aerospace and phased-array radar. Fourth, hermeticity: the dense composite can achieve a leak rate below 10⁻⁸Pa·m³/s, meeting hermetic packaging requirements and isolating moisture and contamination. Fifth, specific heat capacity: its relatively high heat capacity buffers pulsed power surges and suppresses transient junction-temperature spikes. Together, these five properties make diamond metal-matrix composites the preferred choice for thermal management and reliability design of high-power devices such as IGBTs, laser diodes, and RF modules.
美国、欧洲、日本与中国大陆、台湾企业参数对比
Parameter Comparison: US, European, Japanese, Chinese Mainland and Chinese Taiwan Enterprises
基本结论
Basic Conclusions
通过以上的数据可以看出,晶锟科技的指标水平已站到世界一流企业的同一量级 —— 金刚石铝官网口径（850–1000 W/(m・K)）与 Element Six 铜基 45vol%（1000）持平、热膨胀系数CTE 甚至更优。
It can be seen from the above data that the performance indicators of Jingkun Technology have reached the same level as world-class enterprises. The thermal conductivity of diamond-aluminum composites quoted on its official website (850–1000 W/(m·K)) is comparable to that of Element Six’s 45 vol% copper-based composite (1000 W/(m·K)), and its coefficient of thermal expansion (CTE) is even better.
其热膨胀系数与硅，碳化硅，磷化铟，氮化镓在同一数量级范围内。
Its coefficient of thermal expansion (CTE) falls within the same order of magnitude as that of silicon, silicon carbide, indium phosphide and gallium nitride.
热导率：官网 850–1000 已达铝基体系的高位宣称（高于 Denka 的 ≥500），与 E6 铜基 1000 同量级 —— 但金刚石铝做到 850–1000 属行业高水平。
热膨胀系数：官网 5.0–6.0 是全场最低，匹配 GaAs/GaN 化合物半导体的优势明确（E6 7.2 更偏陶瓷 / 基板适配向，住友 6.0）。
密度：铝基 3.2–3.3 与 Denka 3.17 相当，远轻于铜基 DC60（5.0）和银基 AD90（5.9）—— 轻量化卖点成立，适合对重量敏感的机载 / 星载 / 车载场景。
气密性：晶锟<10⁻⁸；客户（尤其军工、光通信气密封装）要求泄漏率指标。
比热容：Denka（0.62）、A.L.M.T.（0.34）、Diamond Materials（0.502），晶锟0.56都已公布基本相当。
Thermal conductivity: The official published value of 850–1000 represents the high-end claimed performance for aluminum-based systems (higher than Denka’s ≥500), on the same order as E6’s copper-based material at 1000. Achieving 850–1000 with diamond-aluminum composites is a high standard in the industry.
Coefficient of thermal expansion (CTE): The official value of 5.0–6.0 is the lowest among all compared materials, offering clear advantages for matching GaAs/GaN compound semiconductors (E6’s 7.2 is more oriented toward ceramic/substrate compatibility; Sumitomo’s value is 6.0).
Density: The aluminum-based material at 3.2–3.3 is comparable to Denka’s 3.17, and much lighter than copper-based DC60 (5.0) and silver-based AD90 (5.9). The lightweight advantage is validated, suitable for weight-sensitive airborne, space-borne and vehicle-borne applications.
Air tightness: Jingkun<10⁻⁸. Customers (especially for military and optical communication hermetic packaging) require specified leakage rate indicators.
Specific heat capacity: Published values are generally comparable: Denka (0.62), A.L.M.T. (0.34), Diamond Materials (0.502), and Jingkun (0.56).
